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3D Stacked 1 Gb DDR SDRAM

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bullet"Leo" Data Sheet (Adobe .pdf format - 13,876 KB)

FaStack® 3D Memory -- 1 Gb Double Data Rate SDRAM
(obsolete)

Memory widths: x64, x16, x8, and x4 (64, 16, 8, or 4 data bits per data transfer)
Lead-free BGA Package
Conforms to JEDEC specification "JESD79", definition DDR-266A
Fastest versions use HyperDDR333 timing (tRAS = 27 ns tRFC = 36 ns)
Double-Data-Rate (DDR) architecture: two data transfers per clock cycle
Bidirectional data strobes
Differential clock inputs
DLL aligns data and strobe signals with CK for read and write operations (edge-aligned for read, center-aligned for write)
Four internal banks, concurrent operation
Auto-Precharge option for each burst
Read Latency: 2 or 2.5 cycles
Auto-Refresh and Self-Refresh modes
7.8 ms maximum average periodic refresh interval (8k/64ms)
2.5 V I/O (SSTL_2 compatible)
VDD = +2.5 V ±0.2 V, VDDQ = +2.5 V ±0.2 V
Maximum burst refresh cycle: 8
Burst types: sequential & interleaved
Burst lengths: 2, 4, or 8 locations

The Leo FaStack® is an integrated circuit that performs as a DDR SDRAM, compatible with the JEDEC DDR I standard, and incorporating features above and beyond that standard. It acts as a high-speed, CMOS, dynamic random-access memory containing 1,073,741,824 bits, configured internally as a quad-bank DRAM. It achieves high-speed operation through a double-data-rate (DDR) architecture - that is, a 2n pre-fetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. Each read or write access consists of a single data transfer (two data words in one clock cycle) at the internal DRAM core, and two corresponding data transfers (each being one data word in one-half clock cycle) at the I/O pins.

A bidirectional data strobe is transmitted externally along with each byte of data for use in data capture at the receiver. Each strobe signal is edge-aligned and transmitted by the DDR SDRAM for reads; it is center-aligned and transmitted by the memory controller for writes. The 64-bit Leo FaStack has eight data strobes, one for each byte; the 16-bit version has 2 data strobes; the 8-bit and 4-bit versions use a single data strobe.

The Leo FaStack operates from a differential clock. Commands (address and control signals) are registered at every positive edge of CK. Input data are registered on both strobe edges; output data are registered to both edges of the strobe as well as to both edges of the clock.

Read and write accesses are burst oriented; each access starts at a selected location and continues for a programmed number of locations in a programmed sequence. An access begins with the registration of an ACTIVATE command, which is then followed by a READ or WRITE command. In all three commands, the bank address bits define the bank to be accessed; the address bus bits registered with the ACTIVATE command define the row to be accessed; the address bus bits registered with the READ or WRITE command define the starting column for the burst access.

Read or write bursts may be programmed for a length of 2, 4, or 8 locations. Enabling the Auto-Precharge function provides a self-timed row precharge that is initiated at the end of the burst access. The pipelined multi-bank architecture hides row precharge and activation time by allowing concurrent operation, thereby providing high effective bandwidth.

Available modes include Auto-Refresh and Power-Down. All inputs are compatible with the JEDEC SSTL_2 standard; outputs are compatible with the JEDEC SSTL_2, Class II standard.

For more information, including pricing and availability, contact:
Tezzaron Semiconductor    630-505-0404   Memory@tezzaron.com

Related Pages:

bulletFaStack® Memory
bulletFaStack® Technology
bulletBi-STAR® Technology
Copyright © 2005-2007 Tezzaron® Semiconductor.  All rights reserved.  Revised: July 30, 2008
 

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